l-band pa driver amplifier the information in this document is subject to change without notice. gaas integrated circuit p p p p PG173TA 1997 document no. p13059ej1v0ds00 (1st edition) date published november 1997 n printed in japan preliminary data sheet description the p PG173TA is l-band pa driver amplifier developed for digital cellular telephone and pcs applications. this device feature high output power and low distortion with 2.8 v low voltage and 25 ma low current operation. it is housed in a very small 6 pin mini-mold package available on tape-and-reel and easy to install and contributes to miniaturizing the systems. features { low operation voltage : v dd = 2.8 v { low distortion : p adj 1 = C60 dbc typ. @ v dd = 2.8 v, f rf = 925 to 960 mhz, p out = +9 dbm external output matching { low operation current : i dd = 25 ma typ. @ v dd = 2.8 v, f rf = 925 to 960 mhz, p out = +9 dbm external output matching { 6 pin mini-mold package application { digital cellular: pdc, gsm, is-95, is-136, pcs etc. ordering information part number package packing form p PG173TA-e3 6 pin mini-mold carrier tape width is 8 mm, quantity is 3 kpcs per reel. remark for sample order, please contact your local nec sales office. (part number for sample order: p PG173TA) absolute maximum ratings (t a = 25c) parameters symbol ratings unit supply voltage v dd 6.0 v input power p in C8 dbm total power dissipation p tot 170 note mw operating temperature t a C30 to +90 c storage temperature t stg C35 to +150 c note mounted on a 50 u 50 u 1.6 mm double copper clad epoxy glass pwb, t a = +85c caution the ic must be handled with care to prevent static discharge because its circuit composed of gaas hj-fet.
preliminary data sheet 2 p p p p PG173TA pin connection and internal block diagram pin no. connection pin no. connection 1v dd1 4 non connection 2 gnd 5 gnd 3v dd2 & out 6 in 3 2 1 4 5 6 g1c (top view) 4 5 6 3 2 1 (bottom view) 3 2 1 4 5 6 recommended operating conditions (t a = 25c) parameters symbol min. typ. max. unit supply voltage 1, 2 v dd1, 2 +2.7 +2.8 +3.0 v input power p in C18 dbm electrical characteristics (unless otherwise specified, t a = 25c, v dd1 = v dd2 = +2.8 v, s s s s /4dqpsk modulated signal input, external output matching) parameters symbol test conditions min. typ. max. unit operating frequency f 925 960 mhz linear gain g l p in = C18 dbm 27 28.5 db total current i dd p in = C18 dbm 25 30 ma adjacent channel power leakage 1 p adj1 p out = +9 dbm, ' f = r 50 khz ?60 ?55 dbc adjacent channel power leakage 2 p adj2 p out = +9 dbm, ' f = r 100 khz ?65 ?60 dbc input return loss rl in 10 db output return loss rl out external matching 10 db
preliminary data sheet 3 p p p p PG173TA evaluation circuit (preliminary) v dd1 = v dd2 = +2.8 v, f = 925 to 960 mhz g1c 1 65 4 2 3 v dd1 v dd2 c2 c3 zo = 50 w r1 l1 l2 zo = 50 w c1 out non connection in using the nec evaluation board c1, c2 1000 pf c3 2.0 pf r1 10 : l1 8.2 nh l2 10 nh
preliminary data sheet 4 p p p p PG173TA evaluation board (epoxy glass, h h h h = 4.6, 0.4 mm thickness) v dd1 out v dd2 in 38 mm 40 mm 6 pin mini-mold package dimensions (unit: mm) 2.8 +0.2 ?.3 0 to 0.1 1.5 +0.2 ?.1 0.3 +0.1 ?.0 123 654 0.95 0.95 1.9 2.9 ?.2 0.13 ?.1 0.8 1.1 +0.2 ?.1
preliminary data sheet 5 p p p p PG173TA recommended soldering conditions this product should be soldered in the following recommended conditions. other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. soldering process soldering conditions recommended condition symbol infrared ray reflow package peak temperature: 235c hour: within 30 s. (more than 210c) time: 3 times, limited days: no. note ir35-00-3 vps package peak temperature: 215c hour: within 40 s. (more than 200c) time: 3 times, limited days: no. note vp15-00-3 wave soldering soldering tub temperature: less than 260c, hour: within 10 s. time: 1 time, limited days: no. note ws60-00-1 pin part heating pin area temperature: less than 300c, hour: within 3 s. limited days: no. note note it is the storage days after opening a dry pack, the storage conditions are 25c, less than 65%, rh. caution the combined use of soldering method is to be avoided (however, except the pin area heating method). for details of recommended soldering conditions for surface mounting, refer to information document semiconductor device mounting technology manual (c10535e).
preliminary data sheet 6 p p p p PG173TA [memo]
preliminary data sheet 7 p p p p PG173TA [memo]
p p p p PG173TA caution the great care must be taken in dealing with the devices in this guide. the reason is that the material of the devices is gaas (gallium arsenide), which is designated as harmful substance according to the law concerned. keep the law concerned and so on, especially in case of removal. the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. nec devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is "standard" unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. anti-radioactive design is not implemented in this product. m4 96. 5
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